Thermal simulator benchmarking using an SOIC package

Author

Doi, Yutaka

Author_Institution

Motorola Inc., Tempe, AZ, USA

fYear

1998

fDate

27-30 May 1998

Firstpage

356

Lastpage

361

Abstract

Benchmarking on three thermal simulators representing the finite element and boundary element methods is conducted to assess their performance for solution of the equilibrium die temperature of a SOIC (small outline integrated circuit). Accuracy and efficiency (speed, meshing, and cost) are compared for the simulators. Compatibility with other CAD (computer aided design) tools such as solid modeler and CFD (computational fluid dynamics) is also investigated

Keywords

boundary-elements methods; circuit CAD; circuit simulation; computational fluid dynamics; finite element analysis; integrated circuit modelling; integrated circuit packaging; mesh generation; thermal analysis; thermal management (packaging); CAD tools; CFD; SOIC; SOIC package; boundary element method; computational fluid dynamics; computer aided design; equilibrium die temperature; finite element method; small outline integrated circuit; solid modeler CAD tool; thermal simulator accuracy; thermal simulator benchmarking; thermal simulator cost; thermal simulator efficiency; thermal simulator meshing; thermal simulator speed; thermal simulators; Boundary element methods; Circuit simulation; Computational fluid dynamics; Computational modeling; Costs; Design automation; Finite element methods; Integrated circuit packaging; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on

Conference_Location

Seattle, WA

ISSN

1089-9870

Print_ISBN

0-7803-4475-8

Type

conf

DOI

10.1109/ITHERM.1998.689587

Filename

689587