Embedded test and measurement critical for deep submicron technology

The embedded test and measurement (ETM) technology has been known in the past by its various other names such as Built-In Test Equipment (BITE), Built-In Test (BIT), Built-In Self-Test (BIST), and Self-Test. However, with deep submicron technology, the comprehensive nature and completeness with which the ETM technology can be implemented goes far beyond the scope that its predecessor had planned considered. It is becoming clear that the ETM technology will be a “must have” technology that will be required to enable the continued growth of the electronics industry. Some of the key factors responsible for driving the shift to ETM and away from external test and measurement are: at-speed testing, the emerging silicon-on-a-chip methodology, time-to-market, the wide use of embedded memories, better defect coverage for higher quality parts and cost. Also critical are issues such as vertical disintegration of the electronics industry, increased consumerism of electronic products, and increased dependence on reliability of telecommunication, control and computers in the our daily lives. Basic research in the ETM technology in the last twenty years has created solutions that are robust and cost effective