Title :
Analysis of the feasibility of dynamic thermal testing in digital circuits
Author :
Altet, Josep ; Rubio, Antonio ; Tamamoto, Hideo
Author_Institution :
Dept. of Electr. Eng., Univ. Politech. de Catalunya, Barcelona, Spain
Abstract :
Temperature can be used as a test observable: some failures when activated produce an increase in local power dissipation, changing the surface thermal map of the IC, being detectable with built-in thermal sensors. In this work, both the feasibility of this testing technique and the generation of the specific test pattern are discussed
Keywords :
digital integrated circuits; dynamic testing; electric sensing devices; fault location; integrated circuit testing; temperature measurement; IC; bridging failure; built-in thermal sensors; controllability; digital circuits; dynamic thermal testing; feasibility; local power dissipation; surface thermal map; test pattern; CMOS digital integrated circuits; Circuit testing; Digital circuits; Heat sinks; Power dissipation; Temperature sensors; Thermal conductivity; Thermal engineering; Thermal sensors; Water heating;
Conference_Titel :
Test Symposium, 1997. (ATS '97) Proceedings., Sixth Asian
Conference_Location :
Akita
Print_ISBN :
0-8186-8209-4
DOI :
10.1109/ATS.1997.643951
