Fabrication of high density multichip modules

Author

Reche, J.J.H.

Author_Institution

Polycon, Ventura, CA, USA

fYear

1989

fDate

25-27 Sep 1989

Firstpage

104

Lastpage

109

Abstract

A novel high-density multilayer interconnect (HDMI) technology has been shown to provide very high functional densities and a fabrication platform for extremely compact and complex systems. The technology comprises an interconnect fabrication method for microelectronic circuits based on vacuum thin-film metallization and polymeric insulation between layers. The HDMI technology makes wafer-scale integration realistic by using a hybrid concept. Semiconductor devices can be built to the practical limit of reasonable yields, then regrouped on a substrate to achieve the desired level of integration. The technology is discussed in connection with photolithography, the effect of three-dimensional topography, alternatives for the definition of metal patterns, and the pattern of polymers

Keywords

hybrid integrated circuits; integrated circuit technology; metallisation; modules; packaging; thin film circuits; WSI; high density multichip modules; hybrid circuits; interconnect fabrication method; metal pattern definition; microelectronic circuits; multilayer interconnect technology; photolithography; polymer patterning; polymeric insulation; substrate; three-dimensional topography; vacuum thin-film metallization; wafer-scale integration; Fabrication; Integrated circuit interconnections; Metallization; Microelectronics; Multichip modules; Nonhomogeneous media; Polymer films; Semiconductor thin films; Thin film circuits; Vacuum technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International

Conference_Location

San Francisco, CA

Type

conf

DOI

10.1109/EMTS.1989.68959

Filename

68959