• DocumentCode
    3189178
  • Title

    Identification and quantification of electrical leakage pathways in floating microelectrode arrays

  • Author

    Bredeson, Samuel D. ; Troyk, Philip R. ; Sungjae Suh ; Bak, Martin

  • Author_Institution
    Illinois Inst. of Technol., Chicago, IL, USA
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    1542
  • Lastpage
    1545
  • Abstract
    The long-term reliability of neural recording and stimulation electrode arrays is becoming the limiting factor for neural interfaces. For effective electrode design, electrical connection to the surrounding neural tissue and fluid should be limited to the electrode tips, with all other leakage currents minimized. It is the goal of this study to identify and quantify electrical leakage within commercially available floating microelectrode arrays (FMAs). Both short term and accelerated stress tests were performed on entire FMAs, as well as on individual electrodes typical of such arrays. Preliminary results of these tests indicate that leakage currents are present due to water penetration of their insulation layer initially, but that prolonged water exposure at high temperature may seal the defects that cause these currents. SEM photos taken of the electrode shafts show extensive defect regions that may correlate with the test data.
  • Keywords
    bioelectric phenomena; biological tissues; biomedical electrodes; leakage currents; microelectrodes; neurophysiology; SEM photos; accelerated stress tests; electrical leakage pathway identification; electrical leakage pathway quantification; floating microelectrode arrays; insulation layer; leakage currents; neural recording; neural tissue; short term wet tests; stimulation electrode arrays; water penetration; Electrodes; Fluids; Impedance; Insulation; Leakage currents; Life estimation; Shafts;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609807
  • Filename
    6609807