Title :
Towards optimizing enhanced surfaces for passive immersion cooled heat sinks
Author :
Baldwin, Chris S. ; Bhavnani, Sushil H. ; Jaeger, Richard C.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
Reduction in die feature-size due to improvements in microelectronics fabrication technology have increased the demands on effective thermal management. As a consequence, innovative heat removal schemes must be explored. Immersion cooling in a dielectric fluid, despite the increased complications, continues to be studied as a possible solution. The characteristics of a surface used as a pool boiling heat sink depend on its microscopic features. This paper reports results from an investigation in which the shape and spacing of these microscopic features were studied in order to achieve improved thermal performance. The heat sources were thin-film heaters deposited in an array on a silicon wafer which was immersed in FC-72 coolant
Keywords :
boiling; cooling; dielectric liquids; electric heating; heat sinks; heating elements; integrated circuit packaging; integrated circuit testing; optimisation; surface topography; thermal analysis; thermal management (packaging); FC-72 coolant; die feature-size; dielectric fluid; enhanced surface optimization; heat removal schemes; heat sources; immersion cooling; microelectronics fabrication technology; microscopic feature shape; microscopic feature spacing; passive immersion cooled heat sinks; pool boiling heat sink surface; silicon wafer; surface microscopic features; thermal management; thermal performance; thin-film heater array; Dielectrics; Fabrication; Heat sinks; Immersion cooling; Microelectronics; Microscopy; Semiconductor thin films; Shape; Technology management; Thermal management;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689593
