DocumentCode :
3189779
Title :
On-line thermal-aware task management for three-dimensional dynamically partially reconfigurable systems
Author :
Yen-Wen Wang ; Ya-Shu Chen
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
fYear :
2013
fDate :
19-21 Aug. 2013
Firstpage :
111
Lastpage :
120
Abstract :
Thermal management is a major design challenge in three-dimensional dynamically partially reconfigurable systems. Unlike three-dimensional integrated circuits, thermal management is more difficult in three-dimensional dynamically partially reconfigurable systems because of the extra heat generated by task reconfiguration. This study proposes an on-line thermal-aware task management scheme to reclaim the run-time thermal slack from low-power tasks, and uses a configurable thermal threshold to achieve a trade-off between the reconfiguration overhead and thermal distribution. The proposed scheme maximizes the tolerable task execution power to better utilize the system and provides a quality of service guarantee under the thermal constraint. This study also evaluates the capability of the proposed methodology using a series of experiments, presenting encouraging results.
Keywords :
field programmable gate arrays; integrated circuit design; low-power electronics; power aware computing; quality of service; reconfigurable architectures; thermal management (packaging); three-dimensional integrated circuits; configurable thermal threshold; low-power tasks; on-line thermal-aware task management; on-line thermal-aware task management scheme; quality of service; reconfiguration overhead; run-time thermal slack; task reconfiguration; thermal constraint; thermal distribution; three-dimensional dynamically partially reconfigurable systems; three-dimensional integrated circuits; tolerable task execution power; Hardware; Heating; Lead; Mathematical model; Microprocessors; Software; Thermal management; 3D field programmable gate arrays; FPGA; dynamic partial reconfiguration; task management; thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Embedded and Real-Time Computing Systems and Applications (RTCSA), 2013 IEEE 19th International Conference on
Conference_Location :
Taipei
ISSN :
1533-2306
Type :
conf
DOI :
10.1109/RTCSA.2013.6732209
Filename :
6732209
Link To Document :
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