• DocumentCode
    3189995
  • Title

    An ASIC-embedded content addressable memory with power-saving and design for test features

  • Author

    Chadwick, Thomas ; Gordon, Tarl ; Nadkarni, Rahul ; Rowland, Jeremy

  • Author_Institution
    Microelectron. Div., IBM Corp., Essex Junction, VT, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    183
  • Lastpage
    186
  • Abstract
    As the available circuit counts of standard-cell ASICs continue to increase, the issues of power dissipation and testability become increasingly important. In response to this trend, the embedded content addressable memory (CAM) described herein was designed with an emphasis on reducing active power dissipation and on improving the in-system testability via built-in self-test (BIST). At the same time, the CAM macro has been designed with flexibility in mind. Application examples will highlight this aspect of the macro. This CAM has been designed and manufactured in a 0.18 μm photolithography process with copper metallization. Results of hardware observations from a test chip confirm functionality in silicon
  • Keywords
    application specific integrated circuits; built-in self test; content-addressable storage; design for testability; integrated circuit metallisation; low-power electronics; photolithography; 0.18 micron; ASIC-embedded content addressable memory; active power dissipation; built-in self-test; design for test features; functionality; in-system testability; metallization; photolithography process; power dissipation; power-saving; standard-cell ASICs; Associative memory; Automatic testing; Built-in self-test; CADCAM; Circuit testing; Computer aided manufacturing; Copper; Lithography; Manufacturing processes; Power dissipation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits, 2001, IEEE Conference on.
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-6591-7
  • Type

    conf

  • DOI
    10.1109/CICC.2001.929751
  • Filename
    929751