• DocumentCode
    3190025
  • Title

    Shared fuse macro for multiple embedded memory devices with redundancy

  • Author

    Ouellette, Michael R. ; Anand, Darren L. ; Jakobsen, Peter

  • Author_Institution
    Microelectron. Div., IBM Corp., Essex Junction, VT, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    191
  • Lastpage
    194
  • Abstract
    Customers designing increasingly complex integrated circuits are turning to ASIC vendors to help bring their products to market faster than their competitors. ASIC designs with large amounts of embedded memory must use fuse-enabled redundancy techniques to maintain price competitive yield. IBM has developed a data compression and shared fuse technique to accommodate large numbers of redundant elements in an ASIC. This technique minimizes or eliminates problems associated with a large number of fuses distributed within many embedded memories on an ASIC
  • Keywords
    DRAM chips; SRAM chips; application specific integrated circuits; data compression; electric fuses; integrated circuit yield; redundancy; ASIC; data compression; fuse-enabled redundancy techniques; multiple embedded memory devices; price competitive yield; redundant elements; shared fuse macro; Application specific integrated circuits; Fuses; Integrated circuit yield; Logic; Manufacturing; Microelectronics; PROM; Random access memory; Strontium; Turning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits, 2001, IEEE Conference on.
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-6591-7
  • Type

    conf

  • DOI
    10.1109/CICC.2001.929753
  • Filename
    929753