DocumentCode
3190025
Title
Shared fuse macro for multiple embedded memory devices with redundancy
Author
Ouellette, Michael R. ; Anand, Darren L. ; Jakobsen, Peter
Author_Institution
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
fYear
2001
fDate
2001
Firstpage
191
Lastpage
194
Abstract
Customers designing increasingly complex integrated circuits are turning to ASIC vendors to help bring their products to market faster than their competitors. ASIC designs with large amounts of embedded memory must use fuse-enabled redundancy techniques to maintain price competitive yield. IBM has developed a data compression and shared fuse technique to accommodate large numbers of redundant elements in an ASIC. This technique minimizes or eliminates problems associated with a large number of fuses distributed within many embedded memories on an ASIC
Keywords
DRAM chips; SRAM chips; application specific integrated circuits; data compression; electric fuses; integrated circuit yield; redundancy; ASIC; data compression; fuse-enabled redundancy techniques; multiple embedded memory devices; price competitive yield; redundant elements; shared fuse macro; Application specific integrated circuits; Fuses; Integrated circuit yield; Logic; Manufacturing; Microelectronics; PROM; Random access memory; Strontium; Turning;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits, 2001, IEEE Conference on.
Conference_Location
San Diego, CA
Print_ISBN
0-7803-6591-7
Type
conf
DOI
10.1109/CICC.2001.929753
Filename
929753
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