Design and characterization of microscale heater structures for test die and sensor applications

Author

Benson, D.A. ; Bowman, D. ; Filter, W. ; Mitchell, Robert ; Perry, J.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

fYear

1998

fDate

27-30 May 1998

Firstpage

434

Lastpage

441

Abstract

We describe a class of microscale heaters fabricated with CMOS processes on silicon wafers. These heaters were designed to produce localized high temperatures above 400°C for test and sensor applications. The temperature levels produced for various input powers and the thermal profiles surrounding the heater for packaged and wafer-level heater structures were studied to guide the placement of microelectronics integrated with the heater structures on the same die. To show the performance of the design, we present resistance sensor measurements, IR temperature profiles, and results from a 3D thermal model of the die. This effort demonstrates that it is possible to successfully operate both a microscale heater and microcircuits on the same die

Keywords

CMOS integrated circuits; electric heating; electric sensing devices; heating elements; integrated circuit design; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; temperature distribution; thermal analysis; thermal management (packaging); 400 C; CMOS processes; IR temperature profiles; Si; design performance; die 3D thermal model; heater design; input power; integrated heater structures; localized high temperatures; microcircuits; microelectronics placement; microscale heater; microscale heater structure characterisation; microscale heater structure design; microscale heater structures; microscale heaters; packaged heater structures; resistance sensor measurements; silicon wafers; test die applications; test sensor applications; thermal profile; wafer-level heater structures; CMOS process; Packaging; Sensor phenomena and characterization; Silicon; Temperature measurement; Temperature sensors; Testing; Thermal resistance; Thermal sensors; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on

Conference_Location

Seattle, WA

ISSN

1089-9870

Print_ISBN

0-7803-4475-8

Type

conf

DOI

10.1109/ITHERM.1998.689598

Filename

689598