Title :
Heat pipes: the silent way to manage desktop thermal problems
Author :
Toth, Jerome ; DeHoff, Robert ; Grubb, Kevin
Author_Institution :
Thermacore Inc., Lancaster, PA, USA
Abstract :
The continuous increase in system power and decrease in available volume present challenges in desktop computer thermal management. Traditional desktop computer design has relied on natural convection from a heat sink placed directly on the processor. With increasing processor power, it has been necessary to add a processor fan to these local heat sinks. Components with moving parts are the most unreliable desktop computer components. The use of heat pipes may eliminate the use of processor fans and their inherent reliability concerns. A heat pipe heat sink is a passive cooling device that requires no moving parts, and operates silently and reliably. Heat pipe technology is emerging as a cost-effective thermal solution for the desktop industry. This paper explains the basic operation of heat pipes and provides a method to assess heat pipe heat sink design feasibility. Issues of heat pipe heat sink manufacturability and reliability are addressed. Fan sinks placed directly over the processor occupy the most valuable real estate in a computer and can interfere with the placement of add-on boards and other system components. Heat pipe sinks transport heat away from the obstructions and constraints of neighbouring boards to where it can be conveniently dissipated. The ability of the heat pipe to be formed to meet location and space availability and its characteristic low ΔT as a function of length permit the heat pipe heat sink system to provide the maximum effective heat sink surface area with minimum volume demand. The heat load can be conducted to open areas within the system
Keywords :
cooling; design engineering; heat conduction; heat pipes; heat sinks; integrated circuit packaging; microcomputers; microprocessor chips; reliability; thermal analysis; thermal management (packaging); add-on board placement; cost-effective thermal management; desktop computer component reliability; desktop computer design; desktop computer thermal management; desktop computers; effective heat sink surface area; fan sinks; heat dissipation; heat load conduction; heat pipe forming; heat pipe heat sink; heat pipe heat sink design feasibility; heat pipe heat sink manufacturability; heat pipe heat sink reliability; heat pipe location availability; heat pipe space availability; heat pipe technology; heat pipes; heat sink; heat transport; local heat sinks; moving parts; natural convection; passive cooling device; processor fan; processor fan reliability; processor power; silent operation; system components; system power; Cooling; Heat sinks; Heat transfer; Manufacturing; Power system management; Space heating; Temperature; Thermal conductivity; Thermal loading; Thermal management;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689601