Title :
Ultrasonic guided waves dispersion reversal for long bone thickness evaluation: A simulation study
Author :
Kailiang Xu ; Chengcheng Liu ; Dean Ta
Author_Institution :
Dept. of Electron. Eng., Fudan Univ., Shanghai, China
Abstract :
It has been shown that ultrasonic guided waves have great potentials for long cortical bone evaluation. However, due to the multimodal dispersion, the received signals usually contain several mixed guided modes, which highly complicates the mode separation and signal processing. In the study, we showed that the use of dispersion reversal excitation allows the self-compensation of the dispersive modes in the long cortical bone. Two-dimension finite-difference time-domain (2D-FDTD) method was employed to simulate the propagation of two fundamental guided modes, symmetrical S0 and anti-symmetrical A0, in the long cortical bones. It was demonstrated that the pulse-like modes of S0 and A0 can be detected under the dispersion reversal excitations. The simulations also illustrated that the proposed dispersion reversal method can be used to evaluate the cortical thickness. Results are promising for the application of dispersion reversal method in ultrasonic assessment of the long cortical bone.
Keywords :
bioacoustics; biomedical ultrasonics; bone; finite difference time-domain analysis; medical signal processing; source separation; ultrasonic dispersion; ultrasonic propagation; 2D-FDTD; antisymmetrical A0; dispersion reversal excitation; fundamental guided mode propagation; long cortical bone thickness evaluation; mixed guided mode; mode separation; multimodal dispersion; pulse-like mode; received signal; self-compensation; simulation study; symmetrical S0; two-dimension finite-difference time-domain method; ultrasonic assessment; ultrasonic guided wave dispersion reversal; Acoustics; Bones; Dispersion; Time-frequency analysis; Transducers; Ultrasonic imaging; Wideband;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
DOI :
10.1109/EMBC.2013.6609904