DocumentCode :
3191143
Title :
A rigorous method for fundamentally eliminating the low-frequency breakdown in full-wave finite-element-based analysis: Combined dielectric-conductor case
Author :
Zhu, Jianfang ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
2010
fDate :
25-27 Oct. 2010
Firstpage :
69
Lastpage :
72
Abstract :
It has been observed that a finite-element based solution of full-wave Maxwell´s equations breaks down at low frequencies. Existing approaches have not rigorously solved the problem yet since they rely on low-frequency approximations. Moreover, little work has been reported for overcoming the low-frequency breakdown for realistic circuit problems in which dielectrics and non-ideal conductors coexist. In this work, we develop a rigorous method to fundamentally eliminate the low-frequency breakdown for the analysis of general problems involving both dielectrics and conductors. Its rigor has been validated by the analysis of realistic on-chip VLSI circuits at frequencies as low as DC. Furthermore, the proposed method is applicable to any frequency, hence constituting a universal solution of Maxwell´s equations in a full electromagnetic spectrum. In addition, given an arbitrary integrated circuit and package structure, the proposed method can be used to quantitatively and rigorously answer critical design questions such as at which frequency full-wave effects become important and etc.
Keywords :
Maxwell equations; VLSI; conductors (electric); electric breakdown; finite element analysis; microprocessor chips; dielectric-conductor case; full electromagnetic spectrum; full-wave Maxwell equation; full-wave effect; full-wave finite-element-based analysis; low-frequency approximation; low-frequency breakdown; nonideal conductor; on-chip VLSI circuit; Approximation methods; Conductors; Dielectrics; Eigenvalues and eigenfunctions; Electric breakdown; Finite element methods; Maxwell equations; Low-frequency breakdown; electromagnetic analysis; finite element methods; full-wave analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
Type :
conf
DOI :
10.1109/EPEPS.2010.5642546
Filename :
5642546
Link To Document :
بازگشت