• DocumentCode
    3191143
  • Title

    A rigorous method for fundamentally eliminating the low-frequency breakdown in full-wave finite-element-based analysis: Combined dielectric-conductor case

  • Author

    Zhu, Jianfang ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • fYear
    2010
  • fDate
    25-27 Oct. 2010
  • Firstpage
    69
  • Lastpage
    72
  • Abstract
    It has been observed that a finite-element based solution of full-wave Maxwell´s equations breaks down at low frequencies. Existing approaches have not rigorously solved the problem yet since they rely on low-frequency approximations. Moreover, little work has been reported for overcoming the low-frequency breakdown for realistic circuit problems in which dielectrics and non-ideal conductors coexist. In this work, we develop a rigorous method to fundamentally eliminate the low-frequency breakdown for the analysis of general problems involving both dielectrics and conductors. Its rigor has been validated by the analysis of realistic on-chip VLSI circuits at frequencies as low as DC. Furthermore, the proposed method is applicable to any frequency, hence constituting a universal solution of Maxwell´s equations in a full electromagnetic spectrum. In addition, given an arbitrary integrated circuit and package structure, the proposed method can be used to quantitatively and rigorously answer critical design questions such as at which frequency full-wave effects become important and etc.
  • Keywords
    Maxwell equations; VLSI; conductors (electric); electric breakdown; finite element analysis; microprocessor chips; dielectric-conductor case; full electromagnetic spectrum; full-wave Maxwell equation; full-wave effect; full-wave finite-element-based analysis; low-frequency approximation; low-frequency breakdown; nonideal conductor; on-chip VLSI circuit; Approximation methods; Conductors; Dielectrics; Eigenvalues and eigenfunctions; Electric breakdown; Finite element methods; Maxwell equations; Low-frequency breakdown; electromagnetic analysis; finite element methods; full-wave analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-6865-2
  • Electronic_ISBN
    978-1-4244-6866-9
  • Type

    conf

  • DOI
    10.1109/EPEPS.2010.5642546
  • Filename
    5642546