Noise Interaction Between Power Distribution Grids and Substrate

Author

Andersson, Daniel A. ; Kristiansson, Simon ; Svensson, Lars J. ; Larsson-Edefors, Per ; Jeppson, Kjell O.

Author_Institution

Chalmers Univ. of Technol., Gothenburg

fYear

2008

fDate

17-19 March 2008

Firstpage

84

Lastpage

89

Abstract

We have investigated the interaction between power delivery and substrate coupling in terms of noise. From our results, we identify that an increased density of substrate contacts does not to any significance decrease noise on the power supply lines. However, the current injected into the substrate is highly dependent on higher-level grid/package inductance and substrate contact density. We have derived statistically that substrate noise variations could be related to these two design parameters to 69.75%. Based on linear fitting, a model that describes the injected current as function of substrate contact density and power delivery inductance is developed.

Keywords

circuit simulation; inductance; integrated circuit modelling; integrated circuit noise; power supply circuits; integrated circuit noise; linear fitting; package inductance; power delivery inductance; power distribution grids; power supply lines; substrate contact density; substrate coupling; Contacts; Inductance; Integrated circuit interconnections; Integrated circuit noise; Noise generators; Packaging; Power distribution; Power grids; Power supplies; Power systems; Substrate noise; power supply;

fLanguage

English

Publisher

ieee

Conference_Titel

Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on

Conference_Location

San Jose, CA

Print_ISBN

978-0-7695-3117-5

Type

conf

DOI

10.1109/ISQED.2008.4479703

Filename

4479703