• DocumentCode
    3191822
  • Title

    Improving high-speed SerDes performance using passive microwave filters along package traces

  • Author

    Bhandal, Amarjit S. ; Young, Brian

  • Author_Institution
    Custom BU Package Design, Texas Instrum., Northampton, UK
  • fYear
    2010
  • fDate
    25-27 Oct. 2010
  • Firstpage
    241
  • Lastpage
    244
  • Abstract
    Lab measurement and simulation results are presented to show how passive capacitive microwave filters along flip-chip package traces can be used to overcome the capacitive discontinuity at the output port of SerDes transceivers to improve link performance. The technique is further developed to demonstrate its ability to shape the near-end eye pattern to improve its height and/or jitter at different data rates up to 17Gbps. The benefits of the technique for devices which deploy many 10´s or 100´s of SerDes links are highlighted.
  • Keywords
    ball grid arrays; flip-chip devices; microwave filters; passive filters; transceivers; SerDes links; SerDes transceivers; capacitive discontinuity; flip-chip package traces; high-speed SerDes performance; lab measurement; passive capacitive microwave filters; Impedance; Jitter; Microwave circuits; Microwave filters; Microwave measurements; Substrates; Capacitive Discontinuity; FC-BGA Packaging; High-speed SerDes; Passive Microwave Filtering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-6865-2
  • Electronic_ISBN
    978-1-4244-6866-9
  • Type

    conf

  • DOI
    10.1109/EPEPS.2010.5642588
  • Filename
    5642588