DocumentCode
3191920
Title
Thermal-Aware IR Drop Analysis in Large Power Grid
Author
Zhong, Yu ; Wong, Martin D F
Author_Institution
Univ. of Illinois at Urbana-Champaign, Urbana
fYear
2008
fDate
17-19 March 2008
Firstpage
194
Lastpage
199
Abstract
Due to the positive feedback loop between power grid Joule heating and the linear temperature dependence of resistivity, non-uniform temperature profiles on the power grid in high-performance IC influence the IR drop in the power grid. Lack of accurate evaluation of thermal effect on the IR drop in the power grid may lead to over-design; or worse, underestimates the IR drop due to increased local temperature. This paper presents a method to compute the temperature-dependent IR drop on the power grid extremely fast. We propose a novel thermal model and a mathematical formulation to compute the temperature profiles on the power grid efficiently. Compared to the traditional thermal lumped model, which gives a much larger thermal network than the original power grid (20 times more nodes), our model takes advantage of power grid properties, and reduces the size of the thermal equivalent network dramatically (only 13% of the size of the power grid). Iterative methods [16] are used to efficiently update the IR drops based on the new temperature profile. Experimental results show that without considering temperature impact, the worst IR drop analysis can have error up to 10%.
Keywords
integrated circuit design; integrated circuit modelling; thermal management (packaging); high-performance IC; large power grid; linear temperature; positive feedback loop; power grid Joule heating; thermal equivalent network; thermal model; thermal-aware IR drop analysis; Conductivity; Error analysis; Feedback loop; Grid computing; Heating; Iterative methods; Mathematical model; Optical computing; Power grids; Temperature dependence; IR drop analysis; power grid; thermal;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
978-0-7695-3117-5
Type
conf
DOI
10.1109/ISQED.2008.4479725
Filename
4479725
Link To Document