DocumentCode
3191935
Title
Constructing 3D package component broadband electrical models with correct DC values
Author
Choi, Jinwoo ; Chen, Zhaoqing ; Becker, Wiren D. ; Morsey, Jason ; Rubin, Barry
Author_Institution
IBM Syst. & Technol. Group, Austin, TX, USA
fYear
2010
fDate
25-27 Oct. 2010
Firstpage
253
Lastpage
256
Abstract
Accurate channel simulations of package interconnections require passive and causal models that faithfully represent the full frequency response from tens of gigahertz to DC. In this paper, we propose and test a method to create accurate models extending to DC while retaining passivity and causality. The model derived by this method is suitable for transient simulations of packaging interconnect systems.
Keywords
electronics packaging; frequency response; integrated circuit interconnections; 3D package component; broadband electrical models; causal models; channel simulations; correct DC values; frequency response; package interconnections; passive models; transient simulations; Connectors; Integrated circuit modeling; Mathematical model; Resistance; Scattering parameters; Solid modeling; Three dimensional displays; SerDes; causality; component; modeling; passivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-6865-2
Electronic_ISBN
978-1-4244-6866-9
Type
conf
DOI
10.1109/EPEPS.2010.5642594
Filename
5642594
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