Title :
Improvements of time-domain transmission waveform and eye diagram of serpentine delay line using guard trace stubs in stripline structure
Author :
Shiue, Guang-Hwa ; Shiu, Jia-Hung ; Chiu, Po-Wei ; Zhang, Zhi-Hao ; Yeh, Man-Ni ; Ku, Wei-Cheng
Author_Institution :
Dept. of Electron. Eng., Chung Yuan Christian Univ., Taoyuan, Taiwan
Abstract :
The utilization of guard traces with two ground vias at both ends to improve the eye opening and jitter for serpentine delay lines has been investigated. However, it is not easy to accomplish using normal manufacturing technology nowadays because the position of the pad of grounded via is surrounded by serpentine trace. This is especially true in normal manufacturing technology, in which size of the via pad is larger. Therefore, this study proposes crosstalk noise reduction of the time-domain transmission (TDT) waveform and eye diagram of the serpentine delay line by guard trace stubs, i.e. the guard trace of one end is grounded via and the other is open-end, with stripline structure. The crosstalk reduced efficiency for using guard trace stubs is the same as when using guard traces on the time domain of the serpentine delay line. This is because, the open-end leads to the noise cancellation mechanism of the guard trace stub. Based on HSPICE simulation, it demonstrates that the utilization of the guard trace stubs can reduce the original TDT crosstalk level by more than 50%, thereby greatly improving the eye opening and jitter. Finally, this study also performs time-domain measurement to validate the proposed analyses.
Keywords :
SPICE; crosstalk; delay lines; interference suppression; strip lines; HSPICE simulation; crosstalk noise reduction; eye diagram; grounded via; guard trace stub; serpentine delay line; stripline structure; time domain transmission waveform; Bit error rate; Crosstalk; Delay lines; Jitter; Signal analysis; Stripline; Time domain analysis; Signal integrity(SI); eye diagram; guard trace; guard trace stub; serpentine delay line; time-domain transmission (TDT);
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
DOI :
10.1109/EPEPS.2010.5642597