Title :
Thermal analysis of a wirebond chip-on-board package
Author :
Pang, John H L ; Tan, Chee-Keong
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Inst., Singapore
Abstract :
The thermal characteristics of a wire-bond COB package with a calibrated thermal chip was investigated by wind tunnel experiments and finite element analysis. Thermal measurements were carried out in a wind tunnel used to simulate steady state natural and forced convection heat transfer conditions. Finite element analysis of the steady state heat transfer condition was simulated using a two-dimensional model of the wire-bond COB package. The finite element model was also employed in a thermal stress analysis of the wire-bond COB package subjected to accelerated thermal cycling loading
Keywords :
chip-on-board packaging; cooling; finite element analysis; forced convection; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; lead bonding; life testing; natural convection; stress analysis; thermal analysis; thermal stresses; wind tunnels; 2D wire-bond COB package model; accelerated thermal cycling loading; calibrated thermal chip; finite element analysis; finite element model; steady state forced convection heat transfer; steady state heat transfer condition; steady state natural convection heat transfer; thermal analysis; thermal characteristics; thermal measurements; thermal stress analysis; wind tunnel tests; wire-bond COB package; wire-bond chip-on-board package; Analytical models; Finite element methods; Force measurement; Heat transfer; Packaging; Semiconductor device measurement; Steady-state; Thermal force; Thermal loading; Thermal stresses;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689607
