DocumentCode
3192334
Title
Thermal macro-modeling of a surface mounted package with a computational fluid dynamic (CFD) tool
Author
Ianni, Marianna Di ; Maffezzoni, Paolo
Author_Institution
Bull Italia, Italy
fYear
1998
fDate
27-30 May 1998
Firstpage
496
Lastpage
500
Abstract
The paper describes an accurate and time efficient thermal model developed for a surface mounted package with the use of a computational fluid dynamics (CFD) tool. As the full simulation of conjugate heat transfer phenomena is a formidable numerical problem, the study tries to identify what aspects should be included in the behavioral or macroscopic model. A prototype package mounted alone on a printed circuit board is set up and the experimental evidence is firstly used to calibrate the model and then to verify its extrapolation capabilities. While numerical simulation requires measured information to be realistically calibrated, it can supply information about temperature and heat distribution which can not be achieved by means of a mere experimental approach
Keywords
circuit analysis computing; computational complexity; computational fluid dynamics; convection; cooling; extrapolation; heat conduction; printed circuit testing; software tools; surface mount technology; thermal analysis; thermal management (packaging); CFD tool; behavioral model; computational fluid dynamics tool; conjugate heat transfer phenomena; extrapolation; heat distribution; macroscopic model; measured information calibration; model calibration; numerical simulation; printed circuit board; prototype package; simulation; surface mounted package; temperature distribution; thermal macro-modeling; time efficient thermal model; Circuit simulation; Computational fluid dynamics; Computational modeling; Extrapolation; Heat transfer; Numerical simulation; Packaging; Printed circuits; Prototypes; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location
Seattle, WA
ISSN
1089-9870
Print_ISBN
0-7803-4475-8
Type
conf
DOI
10.1109/ITHERM.1998.689609
Filename
689609
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