• DocumentCode
    3192334
  • Title

    Thermal macro-modeling of a surface mounted package with a computational fluid dynamic (CFD) tool

  • Author

    Ianni, Marianna Di ; Maffezzoni, Paolo

  • Author_Institution
    Bull Italia, Italy
  • fYear
    1998
  • fDate
    27-30 May 1998
  • Firstpage
    496
  • Lastpage
    500
  • Abstract
    The paper describes an accurate and time efficient thermal model developed for a surface mounted package with the use of a computational fluid dynamics (CFD) tool. As the full simulation of conjugate heat transfer phenomena is a formidable numerical problem, the study tries to identify what aspects should be included in the behavioral or macroscopic model. A prototype package mounted alone on a printed circuit board is set up and the experimental evidence is firstly used to calibrate the model and then to verify its extrapolation capabilities. While numerical simulation requires measured information to be realistically calibrated, it can supply information about temperature and heat distribution which can not be achieved by means of a mere experimental approach
  • Keywords
    circuit analysis computing; computational complexity; computational fluid dynamics; convection; cooling; extrapolation; heat conduction; printed circuit testing; software tools; surface mount technology; thermal analysis; thermal management (packaging); CFD tool; behavioral model; computational fluid dynamics tool; conjugate heat transfer phenomena; extrapolation; heat distribution; macroscopic model; measured information calibration; model calibration; numerical simulation; printed circuit board; prototype package; simulation; surface mounted package; temperature distribution; thermal macro-modeling; time efficient thermal model; Circuit simulation; Computational fluid dynamics; Computational modeling; Extrapolation; Heat transfer; Numerical simulation; Packaging; Printed circuits; Prototypes; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
  • Conference_Location
    Seattle, WA
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-4475-8
  • Type

    conf

  • DOI
    10.1109/ITHERM.1998.689609
  • Filename
    689609