DocumentCode :
3192340
Title :
Process Variability Analysis in DSM Through Statistical Simulations and its Implications to Design Methodologies
Author :
STG, Srinivasa R. ; Srivatsava, Jandhyala ; Narahari Tondamuthuru, R.
Author_Institution :
Intel Technol. (I)(P) Ltd., Bangalore
fYear :
2008
fDate :
17-19 March 2008
Firstpage :
325
Lastpage :
329
Abstract :
Integrated circuit manufacturability in DSM is directly dependent on how well the manufacturing variations are accounted for during the design of circuits. This paper reviews the effect of various process variations in DSM especially systematic and random variations in three process generations 90 nm, 65 nm & 45 nm by doing SPICE simulation and analysis to look at the derating factors depending on the sensitivity to variations. Few individual standard cells are studied as apart of this exercise to see the effect of variation on their delays. Random variations are becoming a significant portion of the overall variations at 45 nm and below. The results suggests the need for selective, location based and variation aware analysis (SLVA) for the designs going forward.
Keywords :
SPICE; integrated circuit design; integrated circuit manufacture; manufacturing processes; nanoelectronics; statistical analysis; DSM; SPICE simulation; design methodologies; integrated circuit manufacturability; location based analysis; manufacturing variations; process variability analysis; random variations; selective analysis; statistical simulations; systematic variations; variation aware analysis; variation effect; Analytical models; Chemical analysis; Circuit simulation; Design methodology; Integrated circuit manufacture; Integrated circuit technology; Manufacturing processes; Process design; Semiconductor process modeling; Uncertainty; DSM; Design Methodologies; Random; Systematic; Variations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
978-0-7695-3117-5
Type :
conf
DOI :
10.1109/ISQED.2008.4479749
Filename :
4479749
Link To Document :
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