• DocumentCode
    3192399
  • Title

    Evaluation of the PTSI Crosstalk Noise Analysis Tool and Development of an Automated Spice Correlation Suite to Enable Accuracy Validation

  • Author

    Venugopal, C.R. ; Soraiyur, Prasanth ; Rao, Jagannath

  • Author_Institution
    SJCE, Mysore
  • fYear
    2008
  • fDate
    17-19 March 2008
  • Firstpage
    334
  • Lastpage
    337
  • Abstract
    As process geometries are shrinking, width of the metal layer is continuously decreasing, height of the layer and wire lengths are increasing, thereby increasing the effect of coupling capacitances. Coupling induced crosstalk may induce unwanted noise on coupled signal nets resulting in functional failure and performance degradation and becomes a significant limitation in achieving first pass silicon success. At the same time the complexity of noise analysis has significantly increased due to factors such as driver weakening, IR drop, power network switching, voltage scaling and variations in manufacturing processes. Therefore validating the capabilities and verifying the analysis of a crosstalk analysis tool for current and future process nodes is very critical for efficient and accurate signoff analysis. The modeling of the cell itself needs to be accurate and comprehensive. The objective of the paper is to share the methodology and challenges involved in crosstalk noise analysis and how the composite current source (CCS) based crosstalk noise analysis capability of primetime SI would help us achieve many of our goals.
  • Keywords
    SPICE; integrated circuit modelling; integrated circuit noise; PTSI tool; SPICE correlation suite; composite current source; crosstalk noise analysis tool; noise immunity curve; noise propagation; Capacitance; Carbon capture and storage; Crosstalk; Degradation; Geometry; Noise reduction; SPICE; Silicon; Voltage; Wire; Crosstalk; Noise Immunity Curve; Noise Propagation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-0-7695-3117-5
  • Type

    conf

  • DOI
    10.1109/ISQED.2008.4479751
  • Filename
    4479751