DocumentCode
3192518
Title
The Statistical Failure Analysis for the Design of Robust SRAM in Nano-Scale Era
Author
Kim, Young-Gu ; Kim, Soo-Hwan ; Lim, Hoon ; Lee, Sanghoon ; Lee, Keun-Ho ; Park, Young-Kwan ; Yoo, Moon-Hyun
Author_Institution
Samsung Electron. Co. Ltd., Hwasung
fYear
2008
fDate
17-19 March 2008
Firstpage
369
Lastpage
372
Abstract
Increase of the process variability with aggressive technology scaling causes many productivity issues in VLSI manufacturing. Analysis about the relationship between process variability and failure has been performed to specify guidelines in both technology and design aspects for yield optimization. By applying the proposed methodology, the core scheme and the operating voltage of the 200 MHz SRAM were determined to secure the immunity to operational failures. In DFM point of view, the statistical circuit analysis for failure characteristics is indispensable to guarantee an optimal yield in manufacturing.
Keywords
SRAM chips; design for manufacture; failure analysis; integrated circuit yield; nanotechnology; statistical analysis; VLSI manufacture; design for manufacture; frequency 200 MHz; nanoscale era; robust SRAM design; statistical circuit analysis; statistical failure analysis; yield optimization; Design optimization; Failure analysis; Guidelines; Manufacturing processes; Performance analysis; Productivity; Random access memory; Robustness; Very large scale integration; Voltage; DFM; SRAM; Statistical failure analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
978-0-7695-3117-5
Type
conf
DOI
10.1109/ISQED.2008.4479759
Filename
4479759
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