Abstract :
Five pilot or production Fabs were set up in the year 2000 to start 300 mm integration wafers. TSMC was one of them and had started a pilot production line in Fab 6, Tainan, Taiwan. After 300 mm tool installation in 3Q/00, TSMC had successfully completed 0.18 μm, 0.15 μm, and 0.13 μm logic process transition from 200 mm to 300 mm. Also, great progress in 300 mm factory automation including wafer transportation, wafer container (Front Opening Unified Pod) management, recipe automatic download, and tool parameter control was obtained. This paper focuses on the progress in these two areas, 300 mm factory automation and 300 mm process technology transition for a 300 mm foundry manufacturing.
Keywords :
integrated circuit manufacture; integrated logic circuits; process control; reviews; 0.13 mum; 0.15 mum; 0.18 mum; 300 mm; 300 mm foundry manufacturing; 3Q/00; Front Opening Unified Pod management; factory automation; integration wafers; logic process transition; overview; pilot Fabs; pilot production line; process technology transition; production Fabs; recipe automatic download; tool installation; tool parameter control; wafer container; wafer transportation; Automatic control; Computer integrated manufacturing; Containers; Floors; Foundries; Manufacturing automation; Manufacturing processes; Production; Road transportation; Semiconductor device manufacture;
