DocumentCode :
3193438
Title :
Fabrication of linear Fresnel lens using UV embossing and a micromachined roller mold
Author :
Zhang, X.Q. ; Liu, K. ; Shan, X.C.
Author_Institution :
Singapore Inst. of Manuf. Technol. (SIMTech), Singapore, Singapore
fYear :
2015
fDate :
27-30 April 2015
Firstpage :
1
Lastpage :
4
Abstract :
Roll-to-roll embossing is able to produce functional optical films with high throughput and lower cost, compared to other conventional manufacturing technologies such like injection molding. In roll-to-roll ultraviolet (UV) embossing, the functional microstructures on an optical film are directly replicated from a high-precision roller mold; the roller mold requires strict control of profile accuracy and optical surface quality which have to be achieved using ultra-precision machining technology. In this study, optical films with linear Fresnel lens array have been developed by using ultra-precision diamond tuning for mold fabrication and roll-to-roll UV embossing for transferring the features from mold to the flexible plastic substrates. The roller mould for making Fresnel lens array was designed in such a way that one Fresnel lens was composed of 166 tiny prisms and all prisms have an equal-feature-height of 0.1 mm, resulting in a focal length of 82.5 mm. With the optimized roll-to-roll UV embossing process, the Fresnel lens film produced in large area demonstrated strong light concentration effect on a solar simulation system, with light intensity increased by more than 6 times.
Keywords :
Fresnel diffraction; micromachining; optical films; rollers (machinery); diamond tuning; linear Fresnel lens array; linear Fresnel lens fabrication; micromachined roller mold; mold fabrication; optical films; roll-to-roll UV embossing; roll-to-roll ultraviolet embossing; roller mould; ultraprecision machining technology; Diamonds; Embossing; Lenses; Optical films; Resins; Fresnel lens; Micromachining; Roller Mold; UV imprinting; roll-to-roll;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location :
Montpellier
Print_ISBN :
978-1-4799-8627-9
Type :
conf
DOI :
10.1109/DTIP.2015.7160981
Filename :
7160981
Link To Document :
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