DocumentCode
3193648
Title
Investigating the Design, Performance, and Reliability of Multi-Walled Carbon Nanotube Interconnect
Author
Nieuwoudt, Arthur ; Massoud, Yehia
Author_Institution
Rice Univ., Houston
fYear
2008
fDate
17-19 March 2008
Firstpage
691
Lastpage
696
Abstract
In this paper, we develop a quantitative design technique for multi-walled carbon nanotube (MWCNT) based interconnect, which we utilize to examine the performance and reliability of future nanotube-based interconnect solutions. Leveraging an analytical RLC model for MWCNTs, we create the first closed-form formulation for the optimal nanotube diameter and nanotube bundle height. The results indicate that the proposed design method decreases delay by 21% and 29% on average compared to non-optimized MWCNTs and single-walled carbon nanotube (SWCNT) bundles. We also find that large diameter MWCNT bundles are significantly more susceptible to process variations than SWCNT bundles, which will have important reliability implications in future nano-scale ICs.
Keywords
carbon nanotubes; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; nanoelectronics; RLC model; closed-form formulation; interconnect design; interconnect performance; interconnect reliability; multiwalled carbon nanotube interconnect; nanoscale ICs; Analytical models; Carbon nanotubes; Conductivity; Contact resistance; Copper; Delay; Design methodology; Integrated circuit interconnections; Predictive models; Wires; Mutli-walled carbon nanotubes; interconnect; interconnect reliability; nanotube interconnect;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
978-0-7695-3117-5
Type
conf
DOI
10.1109/ISQED.2008.4479821
Filename
4479821
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