• DocumentCode
    3193648
  • Title

    Investigating the Design, Performance, and Reliability of Multi-Walled Carbon Nanotube Interconnect

  • Author

    Nieuwoudt, Arthur ; Massoud, Yehia

  • Author_Institution
    Rice Univ., Houston
  • fYear
    2008
  • fDate
    17-19 March 2008
  • Firstpage
    691
  • Lastpage
    696
  • Abstract
    In this paper, we develop a quantitative design technique for multi-walled carbon nanotube (MWCNT) based interconnect, which we utilize to examine the performance and reliability of future nanotube-based interconnect solutions. Leveraging an analytical RLC model for MWCNTs, we create the first closed-form formulation for the optimal nanotube diameter and nanotube bundle height. The results indicate that the proposed design method decreases delay by 21% and 29% on average compared to non-optimized MWCNTs and single-walled carbon nanotube (SWCNT) bundles. We also find that large diameter MWCNT bundles are significantly more susceptible to process variations than SWCNT bundles, which will have important reliability implications in future nano-scale ICs.
  • Keywords
    carbon nanotubes; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; nanoelectronics; RLC model; closed-form formulation; interconnect design; interconnect performance; interconnect reliability; multiwalled carbon nanotube interconnect; nanoscale ICs; Analytical models; Carbon nanotubes; Conductivity; Contact resistance; Copper; Delay; Design methodology; Integrated circuit interconnections; Predictive models; Wires; Mutli-walled carbon nanotubes; interconnect; interconnect reliability; nanotube interconnect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-0-7695-3117-5
  • Type

    conf

  • DOI
    10.1109/ISQED.2008.4479821
  • Filename
    4479821