Three-dimensional modeling of thermal flow in multi-finger high power HBTs

Author

Hattori, R. ; Shimura, Toshihiro ; Kato, Masaaki ; Sonoda, Takuji ; Takamiya, S.

Author_Institution

Optoelectron. & Microwave Devices Lab., Mitsubishi Electr. Corp., Hyogo, Japan

fYear

1995

fDate

16-20 May 1995

Firstpage

461

Abstract

Three-dimensional modeling of thermal flow in multi-finger HBTs has been investigated with thermal network method to find out the optimal structure which can effectively reduce the junction temperature uniformly in whole fingers under the high power operation. Thermal cross-talk effects and temperature distribution in a finger or between the fingers are examined. The HBT structure with emitter air-bridge connected to via hole is proposed as an optimal structure. The estimation accuracy of the calculation was confirmed from the good agreement between the calculation result and the measured value of the thermal resistance in HBT with the emitter air-bridge structure.<>

Keywords

crosstalk; heterojunction bipolar transistors; microwave bipolar transistors; microwave power transistors; power bipolar transistors; semiconductor device models; temperature distribution; thermal resistance; emitter air-bridge; estimation accuracy; junction temperature; microwave power transistors; multi-finger high power HBTs; temperature distribution; thermal cross-talk effects; thermal flow; thermal network method; thermal resistance; three-dimensional modeling; Accuracy; Bridges; Electrical resistance measurement; Electromagnetic heating; Fingers; Gold; Heterojunction bipolar transistors; Microwave devices; Temperature distribution; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1995., IEEE MTT-S International

Conference_Location

Orlando, FL, USA

ISSN

0149-645X

Print_ISBN

0-7803-2581-8

Type

conf

DOI

10.1109/MWSYM.1995.405946

Filename

405946