• DocumentCode
    3193833
  • Title

    Some fundamentals on multifactor surface aging mechanisms of different epoxy resin systems

  • Author

    Park, W.-K. ; König, D. ; Klös, H.J.

  • Author_Institution
    High Voltage Lab., Tech. Hochschule Darmstadt, Germany
  • fYear
    1995
  • fDate
    22-25 Oct 1995
  • Firstpage
    286
  • Lastpage
    289
  • Abstract
    This paper presents investigations on multifactor surface aging of different epoxy resin systems. The main stress factors were liquid contamination and electrical field strength. These stresses were applied via different aging tests, representing on the one hand “soft” and on the other hand “strong” surface stresses. The soft stresses are generated in so-called “inverse” climatic chambers leading to continuous condensation on the surface of the test specimen, while the strong stresses are generated in inclined plane tests. The test results obtained from different materials enable a better understanding of the fundamental surface aging mechanisms and the most decisive parameters of influence, depending on the amount of the surface stress severity
  • Keywords
    ageing; environmental testing; epoxy insulation; epoxy insulators; insulation testing; insulator contamination; leakage currents; partial discharges; aging tests; contaminated insulators; continuous surface condensation; electrical field strength; epoxy resin systems; inclined plane tests; inverse climatic chambers; leakage current; liquid contamination; multifactor surface aging mechanisms; partial discharge activity; soft surface stresses; strong surface stresses; Aging; Chemicals; Epoxy resins; Insulation; Materials testing; Organic materials; Surface contamination; Surface discharges; System testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1995. Annual Report., Conference on
  • Conference_Location
    Virginia Beach, VA
  • Print_ISBN
    0-7803-2931-7
  • Type

    conf

  • DOI
    10.1109/CEIDP.1995.483719
  • Filename
    483719