Modelling of the flow rate dependent partial thermal resistance of integrated microscale cooling structures

Author

Takacs, G. ; Szabo, P.G. ; Bognar, Gy

Author_Institution

Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2015

fDate

27-30 April 2015

Firstpage

1

Lastpage

4

Abstract

As microscale cooling structures are integral parts of modern chip level cooling concepts, the understanding of the behavior of different assemblies is desirable to create a novel co-design concepts where the thermal design is embedded into the conventional IC design flow. The first step of understanding is to create a general formula which describes the heat transfer mechanism and can be implemented in IC CAD environments. This paper presents an analytical study of this mechanism in microscale channel based cooling structures. A closed analytical formula is also given to calculate the partial thermal resistance. Numerical analyses are also conducted and the results are compared against the analytical ones.

Keywords

cooling; integrated circuit design; integrated circuit modelling; microchannel flow; thermal resistance; IC CAD environments; IC design flow; co-design concepts; heat transfer mechanism; microscale cooling structures; modern chip level cooling concepts; partial thermal resistance; thermal design; Cooling; Electronic packaging thermal management; Fluids; Heat transfer; Heating; Thermal resistance; integrated cooler; microchannel heat sink; thermal transient testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on

Conference_Location

Montpellier

Print_ISBN

978-1-4799-8627-9

Type

conf

DOI

10.1109/DTIP.2015.7161012

Filename

7161012