Title :
Limitations to copper grain growth in narrow trenches
Author :
Brongersma, S.H. ; Kerr, E. ; Vervoort, I. ; Maex, K.
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
Even though large variations are seen in transformation times for Copper blanket layers when changing layer thickness or plating current, the activation energy for secondary grain growth is always ∼ 0.9 eV. The difference is attributed to variations in the number of ´nucleation sites´ for secondary grains. As the number of such sites is extremely low in trenches, transformation times are very high even at elevated temperatures.
Keywords :
copper; electroplated coatings; grain growth; metallisation; nucleation; Cu; activation energy; copper blanket layer; damascene processing; electroplating; grain growth; nucleation site; transformation time; trench filling; Acceleration; Additives; Annealing; Conductivity; Copper; Filling; Grain boundaries; Grain size; Impurities; Plasma temperature;
Conference_Titel :
Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
0-7803-6678-6
DOI :
10.1109/IITC.2001.930069
