• DocumentCode
    3194377
  • Title

    The effect of electrohydrodynamic flow on the current conduction on thin ceramic powder layers under corona discharges

  • Author

    Chang, J.S. ; Ichikawa, K.

  • Author_Institution
    Dept. of Eng. Phys., McMaster Univ., Hamilton, Ont., Canada
  • fYear
    1995
  • fDate
    22-25 Oct 1995
  • Firstpage
    392
  • Lastpage
    395
  • Abstract
    Dielectric ceramic powders used are silica and alumina, and experiments are conducted for applied voltage from 0 to -50 KV, dry nitrogen gas flow rate from 0 to 2.5 L/min, and mean powder size from 30 to 250 μm. Corona discharge is generated by a hollow to mesh plate electrode geometry. Gas flow is supplied from a hollow electrode and flow through the powder layer is supported by mesh electrodes. EHD flow is evaluated from pressure drop measurements. The results show that the time averaged conduction current nonmonotonically depends on the powder radius and on dielectric constants. The pressure drop characteristics, and hence EHD flow, depend on the polarity of the applied voltage
  • Keywords
    ceramics; corona; electrical conductivity; electrohydrodynamics; plasma applications; powder technology; surface treatment; 0 to -50 kV; 30 to 250 mum; Al2O3; DC corona discharge induced plasma reactor; SiO2; applied voltage polarity; corona discharge; current conduction; dielectric ceramic powders; dielectric constants; dry N2 gas flow rate; electrohydrodynamic flow; hollow electrode; mean powder size; mesh plate electrode geometry; plasma processing; powder radius; pressure drop measurements; thin ceramic powder layers; time averaged conduction current; Ceramics; Corona; Dielectrics; Electrodes; Electrohydrodynamics; Fluid flow; Nitrogen; Powders; Silicon compounds; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1995. Annual Report., Conference on
  • Conference_Location
    Virginia Beach, VA
  • Print_ISBN
    0-7803-2931-7
  • Type

    conf

  • DOI
    10.1109/CEIDP.1995.483745
  • Filename
    483745