DocumentCode :
3194448
Title :
Parylene-C encapsulation for polymeric cantilever stability
Author :
Maheshwari, Nidhi ; Chatterjee, Gaurav ; Vinchurkar, Madhuri ; Gupta, Gaurav ; Kshirsagar, Hemant ; Narsimhan, K.L. ; Rao, V. Ramgopal
Author_Institution :
Dept. of Electr. Eng., IIT Bombay, Mumbai, India
fYear :
2015
fDate :
27-30 April 2015
Firstpage :
1
Lastpage :
5
Abstract :
Piezo-resistive polymeric cantilevers utilizing SU-8/Carbon Black composite as the piezoresistor and SU-8 as structural layer have been studied extensively for biological and chemical sensing. Owing to their better sensitivity than their Silicon counterparts as well as ease of fabrication, they have found wide spread use for ultra-sensitive detection. The extended use of these cantilevers in aqueous buffers and organic solvents like ethanol make them unstable, leading to erroneous results. It is suspected that absorption of moisture and organic solvents in the bulk and/or the penetration of ions in the case of aqueous buffers, in turn effecting the piezoresistivity, contribute towards this unstable behaviour. The present study demonstrates the encapsulation of cantilevers with varied thickness of Parylene-C and the subsequent stability of cantilevers in buffers and organic solvents.
Keywords :
cantilevers; encapsulation; microfabrication; micromechanical devices; piezoresistive devices; polymer blends; solvents (industrial); Parylene-C; SU-8-carbon black composite; aqueous buffers; cantilevers encapsulation; ethanol; moisture absorption; organic solvents; piezo-resistive polymeric cantilevers; piezoresistivity; piezoresistor; ultra-sensitive detection; Chemicals; Ethanol; Films; Optical sensors; Polymers; Silicon; Cantilever; Parylene; Piezoresistive; SU-8; encapsulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location :
Montpellier
Print_ISBN :
978-1-4799-8627-9
Type :
conf
DOI :
10.1109/DTIP.2015.7161032
Filename :
7161032
Link To Document :
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