Pattern dependent modeling of electroplated copper profiles

Author

Park, Tae H. ; Tugbawa, Tamba E. ; Boning, Duane S.

Author_Institution

Microsystems Technol. Lab., MIT, Cambridge, MA, USA

fYear

2001

fDate

6-6 June 2001

Firstpage

274

Lastpage

276

Abstract

Copper electroplated profiles exhibit pattern dependent topography. We propose a methodology for the characterization and modeling of feature scale copper step heights and the height of copper array regions, as a function of layout parameters. The resulting empirical models with parameters extracted from conventional and super fill plating processes capture several key trends important in electroplating, and are the first step toward an integrated chip-scale copper plating/CMP simulation capability.

Keywords

chemical mechanical polishing; copper; electroplated coatings; electroplating; integrated circuit metallisation; semiconductor process modelling; surface topography; CMP; Cu; array regions height; chip-scale copper plating; deposition model; electroplated copper profiles; feature scale step heights; integrated simulation capability; layout parameters; parameter extraction; pattern dependent modeling; pattern dependent topography; polynomial model; super fill plating; Area measurement; Chemicals; Copper; Data mining; Extraterrestrial measurements; Laboratories; Predictive models; Semiconductor device modeling; Surface topography; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International

Conference_Location

Burlingame, CA, USA

Print_ISBN

0-7803-6678-6

Type

conf

DOI

10.1109/IITC.2001.930082

Filename

930082