DocumentCode :
3196302
Title :
Exploiting thermal-area tradeoffs in high-level synthesis through resources number selection
Author :
Yu, Junbo ; Zhou, Qiang ; Bian, Jinian
Author_Institution :
Comput. Sci. Dept., Tsinghua Univ., Beijing
fYear :
2008
fDate :
25-27 May 2008
Firstpage :
1286
Lastpage :
1290
Abstract :
Thermal crisis has been widely regarded by IC industry. High temperature heavily impacts on reliability, performance, cooling cost and power consumption of ICs. High temperature can be reduced by increasing area. However arbitrarily large area, namely high number of resources in high-level view, dramatically increases IC cost. This paper proposes a technique to achieve proper thermal-area tradeoff. First the most proper resource numbers are identified to equalize different types of resourcespsila power density. And then heuristic synthesis strategy aims to make same types of resourcespsila power density even. We demonstrate that, the proper resources number is achieved when power density of all resources is even. Our solution with the most proper resources number can be a better starting point for the subsequent incremental improvement. As the same area increases, our global optimal solution reduces 44% more peak temperature than our local optimal solution.
Keywords :
integrated circuit packaging; optimisation; thermal management (packaging); IC industry; heuristic synthesis strategy; high-level synthesis; resources number selection; thermal-area tradeoffs; Computer industry; Computer science; Costs; Energy consumption; High level synthesis; Integrated circuit synthesis; Rapid thermal processing; Space heating; Temperature; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications, Circuits and Systems, 2008. ICCCAS 2008. International Conference on
Conference_Location :
Fujian
Print_ISBN :
978-1-4244-2063-6
Electronic_ISBN :
978-1-4244-2064-3
Type :
conf
DOI :
10.1109/ICCCAS.2008.4658002
Filename :
4658002
Link To Document :
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