• DocumentCode
    3196302
  • Title

    Exploiting thermal-area tradeoffs in high-level synthesis through resources number selection

  • Author

    Yu, Junbo ; Zhou, Qiang ; Bian, Jinian

  • Author_Institution
    Comput. Sci. Dept., Tsinghua Univ., Beijing
  • fYear
    2008
  • fDate
    25-27 May 2008
  • Firstpage
    1286
  • Lastpage
    1290
  • Abstract
    Thermal crisis has been widely regarded by IC industry. High temperature heavily impacts on reliability, performance, cooling cost and power consumption of ICs. High temperature can be reduced by increasing area. However arbitrarily large area, namely high number of resources in high-level view, dramatically increases IC cost. This paper proposes a technique to achieve proper thermal-area tradeoff. First the most proper resource numbers are identified to equalize different types of resourcespsila power density. And then heuristic synthesis strategy aims to make same types of resourcespsila power density even. We demonstrate that, the proper resources number is achieved when power density of all resources is even. Our solution with the most proper resources number can be a better starting point for the subsequent incremental improvement. As the same area increases, our global optimal solution reduces 44% more peak temperature than our local optimal solution.
  • Keywords
    integrated circuit packaging; optimisation; thermal management (packaging); IC industry; heuristic synthesis strategy; high-level synthesis; resources number selection; thermal-area tradeoffs; Computer industry; Computer science; Costs; Energy consumption; High level synthesis; Integrated circuit synthesis; Rapid thermal processing; Space heating; Temperature; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems, 2008. ICCCAS 2008. International Conference on
  • Conference_Location
    Fujian
  • Print_ISBN
    978-1-4244-2063-6
  • Electronic_ISBN
    978-1-4244-2064-3
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2008.4658002
  • Filename
    4658002