Changes of the coplanarity of SMT-components during soldering and their Measurement

Author

Wohlrabe, Heinz ; Wolter, Klaus-Jürgen

Author_Institution

Centre of Microtechnical Manuf., Tech. Univ. Dresden, Dresden, Germany

fYear

2010

fDate

13-16 Sept. 2010

Firstpage

1

Lastpage

6

Abstract

The coplanarity between the substrate (or printed board) and the SMD-package is a very important characteristic. This coplanarity depends on the warpage of the board and the package. An insufficient coplanarity can lead to open solder joints and/or bridges of the solder joints. Additional mechanical stress (especially in z-direction) inside of the solder joints may also occur. The warpages of the packages and the boards change during a soldering process. The Thermoire®-Measurement gives the possibility to control the warpage under soldering conditions. The IPC-Bow and the IPC -Twist are characteristics, to evaluate the warpage of printed boards.

Keywords

printed circuits; soldering; surface mount technology; IPC -twist; IPC-bow; SMD-package; SMT-component coplanarity; Thermoire measurement; mechanical stress; printed board; solder joint; warpage control; Cameras; Displacement measurement; Gratings; Ovens; Petroleum; Phase measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Conference_Location

Berlin

Print_ISBN

978-1-4244-8553-6

Electronic_ISBN

978-1-4244-8554-3

Type

conf

DOI

10.1109/ESTC.2010.5642842

Filename

5642842