• DocumentCode
    3197477
  • Title

    Electrical properties of GaAs Schottky diodes with embedded InAs self-assembled quantum dots

  • Author

    Hastas, N.A. ; Dimitriadis, CA ; Dozsa, L. ; Gombia, E. ; Kamarinos, G.

  • Author_Institution
    Dept. of Phys., Thessaloniki Univ., Greece
  • Volume
    1
  • fYear
    2004
  • fDate
    16-19 May 2004
  • Firstpage
    325
  • Abstract
    The electrical properties of InAs self-assembled quantum dots (QDs), embedded in GaAs are investigated by low-frequency noise measurements using Au/n-GaAs Shottky diodes as a test device. The I-V characteristic deviates from the thermionic-emission diffusion theory showing an excess current in the low current region. The noise spectra show a 1/f-like behavior at frequencies up to 100 Hz and 1/f2 behavior at higher frequencies. After decomposition of the different types of noise, from the g-r noise parameters we obtain the time constant and their density NT of the single energy traps lying in the bulk of the n-GaAs capping layer. For the 1/f noise, the current spectral density is proportional to 1F2 at low currents and proportional to IF for higher currents. The noise data are restricted in the current region where there is no influence of the series resistance of the diode. The 1/f noise data originating from interface states between the metal and n-GaAs capping layer, are analyzed.
  • Keywords
    1/f noise; III-V semiconductors; Schottky diodes; gallium arsenide; gold; self-assembly; semiconductor device noise; semiconductor quantum dots; 1/f-like behavior; 100 Hz; Au-GaAs; GaAs Schottky diodes; current spectral density; electrical properties; embedded InAs self-assembled quantum dots; low-frequency noise measurements; thermionic-emission diffusion theory; 1f noise; Automatic testing; Electric variables measurement; Frequency; Gallium arsenide; Gold; Low-frequency noise; Noise measurement; Quantum dots; Schottky diodes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2004. 24th International Conference on
  • Print_ISBN
    0-7803-8166-1
  • Type

    conf

  • DOI
    10.1109/ICMEL.2004.1314630
  • Filename
    1314630