DocumentCode
3197536
Title
Surface modification and wettability of silicone PDMS film
Author
Wang, Kaiying ; Ouyang, Guangming ; Chen, Xuyuan
Author_Institution
Inst. for Micosystem Technol., Vestfold Univ. Coll., Borre, Norway
fYear
2010
fDate
13-16 Sept. 2010
Firstpage
1
Lastpage
3
Abstract
In this work, silicone PDMS (polydimethylsiloxane) films were deposited on 100 mm silicon wafer by spin-coating technique and its surface is modified by plasma CHF3 and O2 treatment in a vacuum chamber, respectively. Wettable surface is obtained through subsequent plasma O2 treatment. Scanning Electron Microscope (SEM) and Energy dispersive x-ray spectroscopy (EDX) indicate that the plasma CHF3 treatment induces the formation of island-like nano-structures. The chemical composition of the island-like nano-structures is silicon-rich in near surface region. The surface roughness increases from 9 nm to 230 nm as plasma treatment time increases from 0 to 40 minutes. The wettability of the PDMS surface is strongly dependent on its roughness and the time of plasma O2 treatment. A typical contact angle of 5 μL water droplet after aging 25 hours at room temperature is about 35 ° on the PDMS surface with roughness 230 nm.
Keywords
X-ray chemical analysis; ageing; contact angle; nanofabrication; nanostructured materials; plasma materials processing; scanning electron microscopy; silicones; spin coating; surface roughness; surface treatment; thin films; wetting; EDX; O2 treatment; SEM; Si; aging; chemical composition; contact angle; energy dispersive X-ray spectroscopy; island-like nanostructures; plasma treatment; scanning electron microscopy; silicon wafer; silicone PDMS Film; silicone polydimethylsiloxane films; spin-coating technique; surface modification; surface roughness; time 25 hour; water droplet; wettability; Films; Physics; Plasmas;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location
Berlin
Print_ISBN
978-1-4244-8553-6
Electronic_ISBN
978-1-4244-8554-3
Type
conf
DOI
10.1109/ESTC.2010.5642871
Filename
5642871
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