• DocumentCode
    3197818
  • Title

    Constructive architecture compliance checking — an experiment on support by live feedback

  • Author

    Knodel, Jens ; Muthig, Dirk ; Rost, Dominik

  • Author_Institution
    Software Eng. (IESE), Fraunhofer Inst. for Exp., Kaiserslautern
  • fYear
    2008
  • fDate
    Sept. 28 2008-Oct. 4 2008
  • Firstpage
    287
  • Lastpage
    296
  • Abstract
    This paper describes our lessons learned and experiences gained from turning an analytical reverse engineering technology - architecture compliance checking - into a constructive quality engineering technique. Constructive compliance checking constantly monitors the modifications made by developers. When a structural violation is detected, the particular developer receives live feedback allowing prompt removal of the violations and hence, training the developers on the architecture. An experiment with six component development teams gives evidence that this training pro-actively prevents architecture decay. The three teams supported by the live compliance checking inserted about 60% less structural violations into the architecture than did the three other development teams. Based on the results, we claim that constructive compliance checking is a promising application of reverse engineering technology to the software implementation phase.
  • Keywords
    conformance testing; program diagnostics; reverse engineering; software architecture; software quality; analytical reverse engineering technology; architecture compliance checking; component development teams; constructive compliance checking; live feedback; quality engineering; Application software; Computer architecture; Documentation; Feedback; Reverse engineering; Software architecture; Software engineering; Software systems; Technology transfer; Turning; PuLSE; SAVE; architecture compliance checking; product line engineering; software architecture; technology transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Software Maintenance, 2008. ICSM 2008. IEEE International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1063-6773
  • Print_ISBN
    978-1-4244-2613-3
  • Electronic_ISBN
    1063-6773
  • Type

    conf

  • DOI
    10.1109/ICSM.2008.4658077
  • Filename
    4658077