Abstract :
The following topics are dealt with: BTI; III-V devices; circuits; memory; BEOL; hot carriers; fWLR-TDDB; and reliabilty.
Keywords :
digital storage; hot carriers; networks (circuits); reliability; semiconductor devices; BEOL; BTI; III-V devices; TDDB; bias temperature instability; fWLR; hot carriers; memory; reliabilty;
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4577-0113-9
DOI :
10.1109/IIRW.2011.6142568
