• DocumentCode
    3197956
  • Title

    Nano materials for microelectronic packaging

  • Author

    Wong, C.P. ; Lin, W. ; Zhang, R.

  • Author_Institution
    Microsyst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper addresses the state-of-the-art nano science and technology regarding next generation high density microelectronics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal interface materials, nano alloys for low temperature surface mount assembly and molecular wires for electrical interconnects.
  • Keywords
    carbon nanotubes; integrated circuit interconnections; integrated circuit packaging; surface mount technology; carbon nanotubes; electrical interconnects; electrical-thermal interface materials; high density microelectronics packaging applications; low temperature surface mount assembly; molecular wires; nano alloys; nanomaterials; nanoscience; Carbon; Electron tubes; Integrated circuits; Presses; RNA; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5642891
  • Filename
    5642891
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3197956