PCB tracks thermal simulation, analysis and comparison to IPC-2152 for electrical current carrying capacity

Author

Bunea, Radu ; Codreanu, Norocel-Dragos ; Ionescu, Ciprian ; Svasta, Paul ; Vasile, Alexandru

Author_Institution

Center for Technol. Electron. & Interconnection Tech., Univ. “Politeh.” of Bucharest, Bucharest, Romania

fYear

2010

fDate

13-16 Sept. 2010

Firstpage

1

Lastpage

4

Abstract

Along with the introduction of the new IPC-2152 standard came several questions: What has changed? How does this new standard affect the PCB design? Are the simulation programs up to date with the standard? And the most important: In practice, how close are we to the standard? In this research, we developed a series of tests to analyze the real thermal behavior of tracks when charged with different constant currents. We used boards with different thicknesses (FR4 0.8mm, FR4 1.6mm, FR2 1.6mm, CEM 1.6mm) and 35um copper thickness and 1mm track width. We also performed simulations of the structures using Ansys. All the results were compared to IPC-2152 standard.

Keywords

printed circuit design; Ansys; IPC-2152 standard; PCB design; PCB tracks thermal simulation; electrical current carrying capacity; size 0.8 mm; size 1.6 mm; size 35 mum; Copper; Couplings; Current measurement; Finite element methods; Load modeling; Solid modeling; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Conference_Location

Berlin

Print_ISBN

978-1-4244-8553-6

Electronic_ISBN

978-1-4244-8554-3

Type

conf

DOI

10.1109/ESTC.2010.5642897

Filename

5642897