• DocumentCode
    3198062
  • Title

    Multi-physics modelling for packaging of Liquid Crystal Displays in harsh environments

  • Author

    Bailey, Chris ; Hua Lu ; Chunyan Yin ; Yek Lee

  • Author_Institution
    Comput. Mech. & Reliability Group, Univ. Of Greenwich, London, UK
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Light emitting diodes (LEDs) can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effects on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes optical and thermal modelling techniques used to predict key design parameters such as luminance and temperature for ruggedized electronic display´s using an array of LEDs as the backlight.
  • Keywords
    LED displays; electronics packaging; liquid crystal displays; LED backlight; adaptive light control; harsh environment; integrated modelling; light emitting diode; liquid crystal display; multi-physics modelling; packaging; reliability; ruggedized electronic display; thermal management; thermal modelling; Green products; Light emitting diodes; Optical reflection; Substrates; Variable speed drives; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5642898
  • Filename
    5642898