DocumentCode
3198062
Title
Multi-physics modelling for packaging of Liquid Crystal Displays in harsh environments
Author
Bailey, Chris ; Hua Lu ; Chunyan Yin ; Yek Lee
Author_Institution
Comput. Mech. & Reliability Group, Univ. Of Greenwich, London, UK
fYear
2010
fDate
13-16 Sept. 2010
Firstpage
1
Lastpage
6
Abstract
Light emitting diodes (LEDs) can provide a number of benefits such as adaptive light control, reduced form factor and other novel techniques to ultimately improve the performance of the display. Some of the design challenges in adopting LEDs are to fully understand their effects on the thermal management, reliability, optical and viewability performance of the display. For the display designer this requires integrated modelling and analysis tools. The paper describes optical and thermal modelling techniques used to predict key design parameters such as luminance and temperature for ruggedized electronic display´s using an array of LEDs as the backlight.
Keywords
LED displays; electronics packaging; liquid crystal displays; LED backlight; adaptive light control; harsh environment; integrated modelling; light emitting diode; liquid crystal display; multi-physics modelling; packaging; reliability; ruggedized electronic display; thermal management; thermal modelling; Green products; Light emitting diodes; Optical reflection; Substrates; Variable speed drives; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location
Berlin
Print_ISBN
978-1-4244-8553-6
Electronic_ISBN
978-1-4244-8554-3
Type
conf
DOI
10.1109/ESTC.2010.5642898
Filename
5642898
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