Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics

Author

Falat, Tomasz ; Felba, Jan ; Moscicki, Andrzej ; Smolarek, Anita ; Bock, Karlheinz ; Bonfert, Detlef

Author_Institution

Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland

fYear

2010

fDate

13-16 Sept. 2010

Firstpage

1

Lastpage

5

Abstract

The influence of nano silver filler content on properties of ink-jet printed structures for microelectronics were investigated. Samples were prepared by using ink with different nano silver filler content: 44%, 41% and 38%. The electrical measurements were performed during and after heating process. It was shown, that filler content does not have a strong influence on sintering time, but it changes the final resistivity of printed and sintered structures. The enhancement of sintering process by UV exposure was also investigated. Preliminary results are promising and the further study will be conducted.

Keywords

ink jet printing; integrated circuits; silver; sintering; ultraviolet radiation effects; Ag; UV exposure; electrical measurements; ink-jet printed structures; microelectronics; nanosilver filler content; printed structures; sintered structures; Conductivity; Electrical resistance measurement; Ink; Microelectronics; Resistance; Resistance heating; Silver;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Conference_Location

Berlin

Print_ISBN

978-1-4244-8553-6

Electronic_ISBN

978-1-4244-8554-3

Type

conf

DOI

10.1109/ESTC.2010.5642899

Filename

5642899