DocumentCode :
3198205
Title :
Reliability analysis of enhancement-mode GaN MIS-HEMT with gate-recess structure for power supplies
Author :
Imada, T. ; Motoyoshi, K. ; Kanamura, M. ; Kikkawa, T.
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
fYear :
2011
fDate :
16-20 Oct. 2011
Firstpage :
38
Lastpage :
41
Abstract :
In this work, the reliability of enhancement-mode GaN MIS-HEMTs with gate-recess structure was investigated. Stress test under the positive gate bias was mainly considered. By the positive gate bias stress, Ron and Vp was varied. This shift was reversible. The deep-level optical spectroscopy (DLOS) suggested deep levels at the gate recessed region. These results lead to the conclusion that Ron and Vp shift was attributed by the deep level at the gate recessed region. By controlling the trap density at recessed region, we can suppress the Ron and Vp shift.
Keywords :
III-V semiconductors; MIS devices; gallium compounds; high electron mobility transistors; semiconductor device reliability; wide band gap semiconductors; DLOS; GaN; deep-level optical spectroscopy; enhancement-mode MIS-HEMT; gate-recess structure; positive gate bias; power supplies; reliability analysis; trap density; Aging; Gallium nitride; HEMTs; Logic gates; MODFETs; Reliability; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4577-0113-9
Type :
conf
DOI :
10.1109/IIRW.2011.6142584
Filename :
6142584
Link To Document :
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