DocumentCode
3198354
Title
An advanced RF-CV method as a powerful characterization tool for the description of HC induced defect generation at microscopic level
Author
Negre, L. ; Roy, D. ; Scheer, P. ; Gloria, D. ; Ghibaudo, G.
Author_Institution
IMEP-LAHC, Grenoble, France
fYear
2011
fDate
16-20 Oct. 2011
Firstpage
73
Lastpage
76
Abstract
A MOS Capacitance-Voltage method in Radio-Frequency domain is presented. Characterization at higher frequency is becoming essential especially for advanced technology nodes that are confronted with gate leakage. Contrary to all other present methods, a full exploitation of S-parameters is performed to get key information regarding defect localization. The technique allows for MOS parameter extraction of the intrinsic and extrinsic components which enhances the scope of the defect localization area. An application of this method is performed to physically analyse the impact of three different energetic hot carrier degradation modes and also point out the unique signature of each degradation mode.
Keywords
MOSFET; S-parameters; hot carriers; radiofrequency measurement; HC induced defect generation; MOS capacitance-voltage method; MOS parameter extraction; S-parameter measurements; advanced RF-CV method; energetic hot carrier degradation modes; extrinsic components; intrinsic components; microscopic level; radiofrequency domain; Capacitance; Degradation; Logic gates; MOSFETs; Resistance; Scattering parameters; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4577-0113-9
Type
conf
DOI
10.1109/IIRW.2011.6142592
Filename
6142592
Link To Document