The rectenna design on contact lens for wireless powering of the active intraocular pressure monitoring system

Author

Cheng, H.W. ; Jeng, B.M. ; Chen, C.Y. ; Huang, H.Y. ; Chiou, J.C. ; Luo, C.H.

Author_Institution

Nat. Cheng Kung Univ., Tainan, Taiwan

fYear

2013

fDate

3-7 July 2013

Firstpage

3447

Lastpage

3450

Abstract

This paper proposed a wireless power harvesting system with micro-electro-mechanical-systems (MEMS) fabrication for noninvasive intraocular pressure (IOP) measurement on soft contact lens substructure. The power harvesting IC consists of a loop antenna, an impedance matching network and a rectifier. The proposed IC has been designed and fabricated by CMOS 0.18um process that operates at the ISM band of 5.8 GHz. The antenna and the power harvesting IC would be bonded together by using flip chip bonding technologies without extra wire interference. The circuit utilized an impedance transformation circuit to boost the input RF signal that improves the circuit performance. The proposed design achieves an RF-to-DC conversion efficiency of 35% at 5.8 GHz.

Keywords

CMOS integrated circuits; analogue-digital conversion; bioMEMS; biomedical measurement; contact lenses; impedance matching; loop antennas; microfabrication; patient monitoring; prosthetics; rectennas; rectifiers; wireless sensor networks; CMOS process; IOP; ISM band; MEMS fabrication; RF-to-DC conversion efficiency; active intraocular pressure monitoring system; bandwidth 5.8 GHz; circuit performance; flip chip bonding technology; impedance matching network; impedance transformation circuit; input RF signal; loop antenna; microelectro-mechanical-system; noninvasive intraocular pressure measurement; power harvesting IC; rectenna design; rectifier; size 0.18 mum; soft contact lens substructure; wireless power harvesting system; Antennas; Energy harvesting; Integrated circuits; Lenses; Monitoring; Rectifiers; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE

Conference_Location

Osaka

ISSN

1557-170X

Type

conf

DOI

10.1109/EMBC.2013.6610283

Filename

6610283