DocumentCode
3198443
Title
On-chip circuit for massively parallel BTI characterization
Author
Silva, M. B da ; Kaczer, B. ; Van der Plas, G. ; Wirth, G.I. ; Groeseneken, G.
Author_Institution
Imec, Leuven, Belgium
fYear
2011
fDate
16-20 Oct. 2011
Firstpage
90
Lastpage
93
Abstract
This work proposes an array-based evaluation circuit for efficient and massively parallel characterization of Bias Temperature Instability (BTI). This design is highly efficient when studying the BTI time-dependent variability in deeply-scaled devices, where hundreds of devices should be tested in order to obtain a statistically significant sample size. The circuit controls stress and measurement times for accurate statistical characterization, making sure all the tested devices have the same stress and recovery times. It significantly improves both area and measurement time. The circuit layout is laid out on the new 28nm node IMEC technology.
Keywords
integrated circuit design; integrated circuit testing; BTI time-dependent variability; IMEC technology; array-based evaluation circuit; bias temperature instability; circuit layout; deeply-scaled devices; on-chip circuit; parallel BTI characterization; size 8 nm; statistical characterization; Degradation; Pollution measurement; Stress; Stress measurement; Temperature measurement; Transistors; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4577-0113-9
Type
conf
DOI
10.1109/IIRW.2011.6142596
Filename
6142596
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