TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration

Author

Druais, G. ; Ancey, P. ; Chapelon, L.L. ; Charbonnier, J. ; Cheramy, S. ; Dodo, Y. ; Farcy, A. ; Garnier, G. ; Guillou, Y. ; Henry, D. ; Leduc, P. ; Pruvost, J. ; Saugier, E. ; Sillon, N.

Author_Institution

STMicroelectronics, Crolles, France

fYear

2010

fDate

13-16 Sept. 2010

Firstpage

1

Lastpage

4

Abstract

3D integration development has to be driven by industrial demand and applications. To get interested in those technological developments, industrials shall be convinced by benefits of Through Silicon Vias (TSV) integration versus traditional assembly approach. This will demonstrate that this approach is worth being more developed and implemented. In this study, we demonstrated that we are able to achieve similar performance for a given product using a standard wire bonding packaging and an integration with TSV. Both electrical measurements on test structures and characterization on product are compared.

Keywords

electronic products; electronics packaging; lead bonding; 3D integration; electrical measurements; standard wire bonding packaging; test characterization; test structures; through silicon vias integration; traditional assembly approach; wireless industrial product; CMOS integrated circuits; CMOS technology; Copper; Industries; Micromechanical devices; Photonics; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Conference_Location

Berlin

Print_ISBN

978-1-4244-8553-6

Electronic_ISBN

978-1-4244-8554-3

Type

conf

DOI

10.1109/ESTC.2010.5642920

Filename

5642920