• DocumentCode
    3198629
  • Title

    Joule heating temperature prediction for inductor

  • Author

    Siegert, Laurent ; Fiannaca, Guillaume ; Gautier, Gaël

  • Author_Institution
    ST Microelectron. Tours R&D, Tours, France
  • fYear
    2011
  • fDate
    16-20 Oct. 2011
  • Firstpage
    121
  • Lastpage
    124
  • Abstract
    The aim of this work is to define a joule heating prediction tool under DC stress for thick copper/Low-k inductors on glass substrate technology. The thermal resistance experimental results have been approximated by an empirical model and, combined with thermal coefficient of resistance formalism; allow us to define an analytical temperature joule heating formula. This analytical joule heating formula can be widely used to define the maximum operating conditions and able to be implemented in design rules manuals.
  • Keywords
    approximation theory; inductors; thermal resistance; DC stress; SiO2; analytical joule heating formula; copper-low-k inductors; glass substrate technology; inductor; joule heating prediction tool; joule heating temperature prediction; resistance formalism; temperature joule heating formula; thermal coefficient; thermal resistance; Copper; Electrical resistance measurement; Inductors; Surface resistance; Temperature measurement; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4577-0113-9
  • Type

    conf

  • DOI
    10.1109/IIRW.2011.6142605
  • Filename
    6142605
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3198629