DocumentCode
319873
Title
Power packaging of a 12 kV, 240°C passive electronic module
Author
Bowers, John S. ; Hopkins, Douglas C. ; Sarjeant, W. James
Author_Institution
Custom Electron. Inc., Oneonta, NY, USA
Volume
1
fYear
1998
fDate
15-19 Feb 1998
Firstpage
504
Abstract
This paper describes packaging design issues related to a high voltage (12 kV), high temperature (240°C) power electronic module developed for military, commercial, and industrial applications. Designs guides are given for materials and qualification of components
Keywords
modules; power electronics; semiconductor device packaging; 12 kV; 240 C; commercial applications; component qualification; high temperature; high voltage; industrial applications; materials design guides; military applications; packaging design; passive electronic module; Aerospace electronics; Aerospace industry; Aerospace materials; Capacitors; Electronic packaging thermal management; Electronics packaging; Industrial electronics; Polymer films; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 1998. APEC '98. Conference Proceedings 1998., Thirteenth Annual
Conference_Location
Anaheim, CA
Print_ISBN
0-7803-4340-9
Type
conf
DOI
10.1109/APEC.1998.647736
Filename
647736
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